JCID UF6008 Adhesive for Mobile Phone PCB Chip Underfill Repair
- — 12 months warranty
- — SMS notification
- — Return and exchange
- — Different payment methods
- — Best price
JCID UF6008 Adhesive for Mobile Phone PCB Chip Underfill Repair
Description:
JCID UF6008 Chip Underfill is a highly reliable and efficient solution for Nand CPU packaging. With its exceptional features, including rapid and even diffusion, automatic curing, softening under high temperatures. And superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device. Make your maintenance work more professional and reliable.
Features:
• The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes
• Cure within 1 min/under 150°C or within 5 min/under 100°C automatically
• Being softened under high temperature, simplify the process of rework
• Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device
Specifications:
Product Name: Chip Underfill
Model: UF6008
Brand: JCID
Storage Conditions: keep stored in cool places at room temperature
Made for: Nand CPU packaging
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